TGF-PCM High performance phase change thermal pad | Aluminum Extruded Cooler Manufacturer | EVERCOOL

EVERCOOL's newly developed TGF-PCM phase change thermal pad is specially designed for high thermal density electronic components.The product uses environmentally friendly phase change materials that do not contain silicon. It is solid at room temperature and is easy to store and carry. After absorbing heat energy at a specific temperature point, it undergoes a phase change and transforms into a semi-fluid state, effectively and automatically filling the tiny gaps on the contact surface, thereby reducing thermal resistance and improving overall thermal conductivity efficiency.
Phase change thermal pads are suitable for applications that require high heat transfer performance and high reliability, such as server processors (CPU, GPU), chipsets, automotive IGBT power modules, LED driver modules and high-density power modules.Its excellent thermal conductivity and extremely low thermal resistance make it an indispensable key thermal management material in high-end electronic devices. EVERCOOL is a high-quality TGF-PCM High performance phase change thermal pad, Phase change thermal pad, thermal gap pad, thermal pad, thermal interface materials manufacturer from Taiwan since 1992. EVERCOOL has more than 30 years of experience in R&D and manufacturing of various fans and heat sinks, providing customers with a full range of cooling solutions and professional consulting services. With 30 years of experience in designing and manufacturing DC fans, AC fans, heatsinks, heat pipes, and related peripheral products.