Bonded Fin Heat Sink Manufacturing Process
Customized Bonded Fin cooling module solution
What is Bonded Fin Heat Sink manufacturing technology?
The Bonded Fin heatsink manufacturing process utilizes a highly efficient heat dissipation structure that combines metal fins with a base.
Aluminum or copper fins are secured to a precisely machined grooved base using a highly thermally conductive epoxy or soldering method. This creates a high-aspect-ratio, high-density fin array, significantly improving convection efficiency and heat dissipation surface area.
In high-power electronic devices, power modules, or welding equipment, heat dissipation structure design must not only accommodate large heat sources but also consider the flow field to quickly dissipate heat.
Evercool Bonded Fin heat dissipation modules utilize highly thermally conductive epoxy resin and precision bonding technology to achieve high-density and high-performance heat dissipation structure integration, providing a stable and reliable heat dissipation solution for various high-density heat source applications.
Core Advantages
- High-Density, High-Efficiency Heatsink Structure:
- The high-aspect-ratio fin design significantly increases the heat dissipation area, improving overall heat dissipation efficiency.
- Flexible Bimetal Combination:
- You can freely choose between copper or aluminum fins and bases to achieve a balance between thermal conductivity and cost requirements.
- Flexible Structural Design:
- Supports a variety of sizes, spacing, and arrangements, allowing adjustment to the actual heat source shape and airflow direction.
- High-Thermal Conductivity Adhesive Bonding Technology:
- A dedicated thermally conductive epoxy bonding process ensures low thermal resistance, high structural strength, and long-term stability.
- Supports Active Air and Liquid Cooling:
- Can be integrated with Evercool's high-efficiency DC/AC cooling fans or liquid cooling systems to create a hybrid cooling solution.
Bonded Fin Heat Sink Production
Prepare the aluminum / copper base and heat sink according to the design drawings, and make the grooved base.
Heat sink and base are connected together with epoxy resin.
Machining and surface treatment on the base and fins to form a bonded fin heat sink.
Appearance surface treatment.
Typical application scenarios
- IGBT components
- Welding equipment
- Motor equipment
- High-power semiconductors
- Laser systems
- Renewable energy
- Factory automation
- Thermoelectric modules
- Uninterruptible power supply systems
- AC welding switches
- Power rectifier equipment
- Traction control motor drive cooling
- Gallery
Aluminum Bottom Hole and fin Combination Products
Large bonded fin heat sink products
Upper and lower fin combination products
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