High Performance Thermal Pad
Thermal Gap Pads, Thermal Interface Materials
EVERCOOL newly develops high-performance heat conduction pads, which are manufactured using nanomaterials.
It has good thermal conductivity, soft compressibility, slightly viscous on both sides, insulation, and good heat transfer effect.
The user can cut it to the required size according to the needs, and can quickly attach it to the surface of the object that needs heat dissipation. It is suitable for multiple heat sources to fill the gap between the heat source and the heat sink, such as memory chips, LEDs, power modules, etc.
This high-performance heat conduction pad has different thicknesses of 0.5~3mm, and you can choose the appropriate thickness according to the actual situation.
- Production of nano-materials with a thermal conductivity of 13.5 W/m-K Easy cutting, convenient for users to cut to the suitable size.
- Good flexibility and can be compressed to fill gaps in different wafers.
- Different thicknesses are available for consumers to choose.
- Work stably between -40°C ~ 200°C, wide application range.
- The heat conduction pad is insulated and non-conductive, environmentally friendly and non-toxic, and has passed the ROHS test, making it safer to use.
- Color: Gray
- Density: 3.4g/cm³
- Thermal Conductivity: 13.5W/m-K
- Work Temperature: -40 ~ 200°C
- Hardness: 30 ~ 60 Sc
- Breakdown Voltage: 6000V
- Volume Resistivity: 8.6 x 109 Ohm-cm
|Model No.||Size (mm)|
|TGF-N/0.5||90 x 50 x 0.5|
|TGF-N/1||90 x 50 x 1|
|TGF-N/1.5||90 x 50 x 1.5|
|TGF-N/2||90 x 50 x 2|
|TGF-N/3||90 x 50 x 3|
- High performance thermal pad, easy to cut with adhesion on both sides, convenient to use.
- The thermal pad is slightly adhesive but non-conductive, making it easy to attach to the desired location.
- Available in various thicknesses, different thicknesses can be selected based on the height difference of the chip.
- High-performance thermal pad ROHS qualified, environmentally friendly and non-toxic insulation properties, suitable for most applications.
- High performance thermal pad packaging diagram.
High Performance Thermal Pad | Aluminum Extruded Cooler Manufacturer | EVERCOOL
Based in Taiwan since 1992, EVERCOOL Thermal Co., Ltd. has been a manufacturer of CPU coolers. Its main products include, High Performance Thermal Pad, CPU cooling system, CPU cooler radiator, extruded aluminum heatsink CPU cooler, low profile CPU cooling cooler fan, SSD cooling fan, HDD cooling fan, hard drive cooler and related peripheral products, which are non-toxic and has passed CE, UL and TUV standards.
EVERCOOL has more than 30 years of experience in R&D and manufacturing of various fans and heat sinks, providing customers with a full range of cooling solutions and professional consulting services. With 30 years of experience in designing and manufacturing DC fans, AC fans, heatsinks, heat pipes, and related peripheral products.
EVERCOOL has been providing customers with high quality CPU coolers since 1992, with both advanced technology and 18 years of experience, EVERCOOL ensures that each customer's requirements are met.