HPK10025


EVERCOOL professional technology, Aluminum heat sink optimizes the heat dissipation and fastens the heat conductivity. Our demand for high quality presents you highly efficient heat dissipation and cooling

 Intel Socket LGA
INTEL Socket LGA 1366 / 775

 Features
• 4 heatpipes in 6mm and H.D.T. Tech can make the maximum cooling efficiency.
• Application for Intel LGA 1366 & 775 series.
• The 10cm extremely quiet fan provides more air flow while using.

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Description

 Compatibility
• INTEL Socket LGA 1366 / 775

 Features
• Crotch Fin Provides more Heat Dissipation Area.
• Max TDP 95 W
• Low Profile Design suit to 1.5U system.

 Specifications

Overall Dimension : 118 x 110 x 67 mm
Heat Sink Material : 4 Heatpipes + Al Fin + H.D.T.Core
Bearing Type : Ever Lubricate Bearing (Long Life bearing)
DC Fan Speed : 1800 ± 15% RPM
Noise Level : < 23 dBA
Rated Voltage : 12 V.DC
Weight : 320 g

 Packing Detail

QTY : 20 pcs
N.W : 6.6 kg
G.W. : 10.1 kg
MEAST : 2.11 ‘
CTN Size : 66.5 × 45 × 20 cm