EC155A 915SP


EVERCOOL professional technology, Aluminum heat sink optimizes the heat dissipation and fastens the heat conductivity. Our demand for high quality presents you highly efficient heat dissipation and cooling

 Intel Socket LGA
Intel LGA 115X Core i3/i5/i7

 Features
• Max TDP 73 W.
• Crotch Fin Provides more Heat Dissipation Area.
• Back Holder Design Keeps the Mainboard from Deforming.
• Low Profile Design suit to 1U system.

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Description

 Compatibility
Intel LGA 115X Core i3/i5/i7

 Features
• Max TDP 73 W.
• Crotch Fin Provides more Heat Dissipation Area.
• Back Holder Design Keeps the Mainboard from Deforming.
• Low Profile Design suit to 1U system.

 Specifications

Overall Dimension : Φ 95 x 30 mm
Heat Sink Material : Aluminum
Bearing Type : Seelve Bearing Fan Life Expectancy at 25℃ 25000HR
DC Fan Speed : 1000 ± 15% ~ 2600 ± 15% RPM
Air Flow : 18.3~47.6 CFM
Noise Level : < 24.8 dBA ~ < 33.4 dBA
Static Pressure : 0.04~0.15 Inch H2O
Rated Voltage : 12 V.DC
Weight : 200 g

 Packing Detail

QTY : 30 pcs
N.W : 8.15 kg
G.W. : 10.85 kg
MEAST : 1.2 ‘
CTN Size : 55 x 33.5 x 18.5 cm